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Insights into DeepSeek-V3: Scaling Challenges and Reflections on Hardware for AI Architectures

14 May 2025
Chenggang Zhao
Chengqi Deng
Chong Ruan
Damai Dai
Huazuo Gao
Jiashi Li
Liyue Zhang
P-Y Huang
Shangyan Zhou
Shirong Ma
Wenfeng Liang
Ying He
Yishuo Wang
Yuxuan Liu
Y. X. Wei
    MoE
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Abstract

The rapid scaling of large language models (LLMs) has unveiled critical limitations in current hardware architectures, including constraints in memory capacity, computational efficiency, and interconnection bandwidth. DeepSeek-V3, trained on 2,048 NVIDIA H800 GPUs, demonstrates how hardware-aware model co-design can effectively address these challenges, enabling cost-efficient training and inference at scale. This paper presents an in-depth analysis of the DeepSeek-V3/R1 model architecture and its AI infrastructure, highlighting key innovations such as Multi-head Latent Attention (MLA) for enhanced memory efficiency, Mixture of Experts (MoE) architectures for optimized computation-communication trade-offs, FP8 mixed-precision training to unlock the full potential of hardware capabilities, and a Multi-Plane Network Topology to minimize cluster-level network overhead. Building on the hardware bottlenecks encountered during DeepSeek-V3's development, we engage in a broader discussion with academic and industry peers on potential future hardware directions, including precise low-precision computation units, scale-up and scale-out convergence, and innovations in low-latency communication fabrics. These insights underscore the critical role of hardware and model co-design in meeting the escalating demands of AI workloads, offering a practical blueprint for innovation in next-generation AI systems.

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@article{zhao2025_2505.09343,
  title={ Insights into DeepSeek-V3: Scaling Challenges and Reflections on Hardware for AI Architectures },
  author={ Chenggang Zhao and Chengqi Deng and Chong Ruan and Damai Dai and Huazuo Gao and Jiashi Li and Liyue Zhang and Panpan Huang and Shangyan Zhou and Shirong Ma and Wenfeng Liang and Ying He and Yuqing Wang and Yuxuan Liu and Y.X. Wei },
  journal={arXiv preprint arXiv:2505.09343},
  year={ 2025 }
}
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